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Repositori InstitusiUniversitas Islam Negeri Mahmud Yunus Batusangkar
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BookOpen AccessTerbit 2018Versi 1

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

Institute for Interconnecting and Packaging Electronic Circuits
Koleksi Perpustakaan•1 dilihat · 0 unduhan
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Informasi bibliografis

Identifier OAIoai:ais:library-item:102081
Jenis dokumenBook
Bahasaen
KoleksiKoleksi Perpustakaan
dc.type
Book
dc.rights.access
OPEN_ACCESS
dc.date.issued
2018-07-19

Versi dan riwayat publik

  1. Versi 1Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards2018 · oai:ais:library-item:102081